List of AMD Ryzen processors
The Ryzen family is an x86-64 microprocessor family from AMD, based on the Zen microarchitecture. The Ryzen lineup includes Ryzen 3, Ryzen 5, Ryzen 7, Ryzen 9, and Ryzen Threadripper with up to 96 cores. All consumer desktop Ryzens (except PRO models) and all mobile processors with the HX suffix have an unlocked multiplier. In addition, all support Simultaneous Multithreading (SMT) except earlier Zen/Zen+ based desktop and mobile Ryzen 3, and some models of Zen 2 based mobile Ryzen.
Desktop processors
Ryzen 1000 series
Summit Ridge (1000 series, Zen based)
Common features of Ryzen 1000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-2666 in dual-channel mode.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- Node/fabrication process: GlobalFoundries 14 LP.
Whitehaven (Threadripper 1000 series, Zen based)
Common features of Ryzen 1000 HEDT CPUs:
- Socket: TR4.
- All the CPUs support DDR4-2666 in quad-channel mode.
- All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- Node/fabrication process: GlobalFoundries 14LP.
Ryzen 2000 series
Raven Ridge (2000 series with Radeon Graphics, Zen/GCN5 based)
Common features of Ryzen 2000 desktop APUs:
- Socket: AM4.
- All the CPUs support DDR4-2933 in dual-channel mode.
- All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated GCN 5th generation GPU.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- Fabrication process: GlobalFoundries 14LP.
Pinnacle Ridge (2000 series, Zen+ based)
Common features of Ryzen 2000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-2933 in dual-channel mode, except for R7 2700E, R5 2600E, R5 1600AF and R3 1200AF which support it at DDR4-2666 speeds.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- Fabrication process: GlobalFoundries 12LP (14LP+).
Colfax (Threadripper 2000 series, Zen+ based)
Common features of Ryzen 2000 HEDT CPUs:
- Socket: TR4.
- All the CPUs support DDR4-2933 in quad-channel mode.
- All the CPUs support 64 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- Fabrication process: GlobalFoundries 12LP (14LP+).
Ryzen 3000 series
Picasso (3000 series with Radeon Graphics, Zen+/GCN5 based)
Common features of Ryzen 3000 desktop APUs:
- Socket: AM4.
- All the CPUs support DDR4-2933 in dual-channel mode.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: GlobalFoundries 12LP (14LP+).
Matisse (3000 series, Zen 2 based)
Common features of Ryzen 3000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 7FF.
Castle Peak (Threadripper 3000 series, Zen 2 based)
Common features of Ryzen 3000 HEDT/workstation CPUs:
- Socket: sTRX4 (Threadripper), sWRX8 (Threadripper PRO).
- Threadripper CPUs support DDR4-3200 in quad-channel mode while Threadripper PRO CPUs support DDR4-3200 in octa-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- Threadripper CPUs support 64 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 7FF.
Ryzen 4000 series
Renoir (4000 series, Zen 2 based)
Based on the Ryzen 4000G series APUs with the integrated GPU disabled. Common features of Ryzen 4000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 7FF.
- Bundled with AMD Wraith Stealth
The AMD 4700S and 4800S desktop processors are part of a "desktop kit" that comes bundled with a motherboard and GDDR6 RAM. The CPU is soldered, and provides 4 PCIe 2.0 lanes. These are reportedly cut-down variants of the APUs found on the PlayStation 5 and Xbox Series X and S repurposed from defective chip stock.
Renoir (4000 series with Radeon Graphics, Zen 2/GCN5 based)
Common features of Ryzen 4000 desktop APUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Ryzen 5000 series
Vermeer (5000 series, Zen 3 based)
Common features of Ryzen 5000 desktop CPUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- All the CPUs support 24 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- L1 cache: 64 KB per core (32 KB data + 32 KB instruction).
- L2 cache: 512 KB per core.
- Fabrication process: TSMC 7FF.
Cezanne (5000 series, Zen 3 based)
Cezanne based CPUs that have the integrated GPU disabled. Common features of Ryzen 5000 (Cezanne) desktop CPUs:
- Socket: AM4.
- CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 7FF.
Cezanne (5000 series with Radeon Graphics, Zen 3/GCN5 based)
Common features of Ryzen 5000 desktop APUs:
- Socket: AM4.
- All the CPUs support DDR4-3200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Chagall (Threadripper 5000 series, Zen 3 based)
Common features of Ryzen 5000 workstation CPUs:
- Socket: sWRX8.
- All the CPUs support DDR4-3200 in octa-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 128 PCIe 4.0 lanes. 8 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 7FF.
Ryzen 7000 series
Raphael (7000 series, Zen 4/RDNA2 based)
Common features of Ryzen 7000 desktop CPUs:
- Socket: AM5.
- All the CPUs support DDR5-5200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). Models with "F" suffixes are without iGPUs.
- Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
Storm Peak (Threadripper 7000 series, Zen 4 based)
Common features of Ryzen 7000 HEDT/workstation CPUs:
- Socket: sTR5.
- Threadripper CPUs support DDR5-5200 in quad-channel mode while Threadripper PRO CPUs support DDR5-5200 in octa-channel mode with ECC support.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- Threadripper CPUs support 48 PCIe 5.0 and 24 PCIe 4.0 lanes while Threadripper PRO CPUs support 128 PCIe 5.0 lanes. In addition, all processor models have 4 PCIe 4.0 lanes reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 5FF.
Ryzen 8000 series
Phoenix (8000 series, Zen 4 based)
Common features of Ryzen 8000 desktop CPUs:
- Socket: AM5.
- All the CPUs support DDR5-5200 RAM in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 20 PCIe 4.0 lanes. 4 of the lanes are reserved as link to the chipset.
- No integrated graphics.
- Fabrication process: TSMC 4 nm FinFET.
Phoenix (8000 series with Radeon Graphics, Zen 4/RDNA3/XDNA based)
Common features of Ryzen 8000G desktop APUs:
- Socket: AM5.
- All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated RDNA 3 GPU.
- Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
- Fabrication process: TSMC 4 nm FinFET.
Ryzen 9000 series
Granite Ridge (9000 series, Zen 5 based)
Common features of Ryzen 9000 desktop CPUs:
- Socket: AM5.
- All the CPUs support DDR5-5600 in dual-channel mode.
- All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated RDNA2 GPU with 2 CUs and base and boost clock speeds of 0.4 GHz and 2.2 GHz, respectively.
- L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- Fabrication process: TSMC N4 FinFET (N6 FinFET for the I/O die).
Mobile processors
Ryzen 2000 series
Raven Ridge (Zen/GCN5 based)
Common features of Ryzen 2000 notebook APUs:
- Socket: FP5.
- The U-series CPUs support DDR4-2400 in dual-channel mode, while the H-series CPUs support it at DDR4-3200 speeds.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 12 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: GlobalFoundries 14LP.
Ryzen 3000 series
Dalí (Zen/GCN5 based)
Common features of Ryzen 3000 notebook APUs:
- Socket: FP5.
- All the CPUs support DDR4-2400 in dual-channel mode.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 12 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: GlobalFoundries 14LP.
Picasso (Zen+/GCN5 based)
Common features of Ryzen 3000 notebook APUs:
- Socket: FP5.
- All the CPUs support DDR4-2400 in dual-channel mode.
- L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: GlobalFoundries 12LP (14LP+).
Ryzen 4000 series
Renoir (Zen 2/GCN5 based)
Common features of Ryzen 4000 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Ryzen 5000 series
Lucienne (Zen 2/GCN5 based)
Common features of Ryzen 5000 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Cezanne and Barceló (Zen 3/GCN5 based)
Cezanne (2021 models), Barceló (2022 models). Common features of Ryzen 5000 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC 7FF.
Ryzen 6000 series
Rembrandt (Zen 3+/RDNA2 based)
Common features of Ryzen 6000 notebook APUs:
- Socket: FP7, FP7r2.
- All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 4.0 lanes.
- Native USB 4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Ryzen 7000 series
Mendocino (7020 series, Zen 2/RDNA2 based)
Common features of Ryzen 7020 notebook APUs:
- Socket: FT6
- All the CPUs support LPDDR5-5500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 4 PCIe 3.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 1
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Barcelo-R (7030 series, Zen 3/GCN5 based)
Common features of Ryzen 7030 notebook APUs:
- Socket: FP6.
- All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 3.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated GCN 5th generation GPU.
- Fabrication process: TSMC N7 FinFET.
Rembrandt-R (7035 series, Zen 3+/RDNA2 based)
Common features of Ryzen 7035 notebook APUs:
- Socket: FP7, FP7r2.
- All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 512 KB per core.
- All the CPUs support 16 PCIe 4.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 2 GPU.
- Fabrication process: TSMC N6 FinFET.
Phoenix (7040 series, Zen 4/RDNA3/XDNA based)
Common features of Ryzen 7040 notebook APUs:
- Socket: FP7, FP7r2, FP8.
- All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All models support AVX-512 using a half-width 256-bit FPU.
- PCIe 4.0 support.
- Native USB 4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Includes integrated RDNA 3 GPU.
- Includes XDNA AI Engine (Ryzen AI).
- Fabrication process: TSMC N4 FinFET.
Dragon Range (7045 series, Zen 4/RDNA2 based)
Common features of Ryzen 7045 notebook CPUs:
- Socket: FL1.
- All the CPUs support DDR5-5200 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes.
- Native USB 4 (40Gbps) Ports: 0
- Native USB 3.2 Gen 2 (10Gbps) Ports: 4
- Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).
- Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).
Ryzen 8000 series
Hawk Point (8040 series, Zen 4/RDNA3/XDNA based)
Key features of Ryzen 8040 notebook APUs:
- Socket: BGA (FP7, FP7r2 or FP8 type packages).
- All models support DDR5-5600 or LPDDR5X-7500 in 128-bit "dual-channel" mode.
- CPU uses Zen4 cores (Phoenix) or a combination of Zen4 and Zen4c cores (Phoenix2).
- GPU uses the RDNA 3 (Navi 3) architecture.
- Some models include first generation Ryzen AI NPU (XDNA).
- All models support AVX-512 using a half-width 256-bit FPU.
- PCIe 4.0 support.
- Native USB 4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- Fabrication process: TSMC N4 FinFET.
Ryzen 200 series
Hawk Point Refresh (200 series, Zen 4/RDNA3/XDNA based)
Ryzen AI 300 series
Strix Point and Krackan Point (Zen 5/RDNA3.5/XDNA2 based)
Common features of Ryzen AI 300 notebook APUs:
- Socket: BGA, FP8 package type.
- All models support DDR5-5600 or LPDDR5X-8000 in dual-channel mode.
- All models support 16 PCIe 4.0 lanes.
- Native USB4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10Gbps) Ports: 2
- iGPU uses the RDNA 3.5 microarchitecture.
- NPU uses the XDNA 2 AI Engine (Ryzen AI).
- Both Zen5 and Zen5c cores support AVX-512 using a half-width 256-bit FPU.
- L1 cache: 80 KB (48 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- Fabrication process: TSMC N4P FinFET.
Strix Halo (Zen 5/RDNA3.5/XDNA2 based)
Ryzen 9000 series
Fire Range (Zen 5/RDNA2 based)
Common features of Ryzen 9000 Fire Range series:
- Socket: FL1
- All Models support DDR5-5600 in 128-bit mode; Maximum memory: 96 GB
- All models support 28 PCIe 5.0 lanes
- Native USB4 (40Gbps) Ports: 2
- Native USB 3.2 Gen 2 (10 Gbps): 4
- Native USB 2.0 (480 Mbps): 1
- iGPU: AMD Radeon 610M (2 CU @ 2200 MHz)
- No NPU
- L1 cache: 80 KB (48 KB data + 32 KB instruction) per core
- L2 cache: 1 MB per core
- Fabrication process: TSMC N4 FinFET (CCD) + TSMC N6 FinFET (I/OD)
Handheld gaming PC processors
Ryzen Z1 series (Zen 4/RDNA3 based)
Common features of Ryzen Z1 handheld APUs:
- Socket: FP7, FP7r2, FP8.
- All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 20 PCIe 4.0 lanes.
- Includes integrated RDNA 3 GPU.
- Fabrication process: TSMC 4 nm FinFET.
Ryzen Z2 series (Zen (3+/4/5)/RDNA(2/3/3.5) based)
Embedded processors
1000 series
Great Horned Owl (V1000 series, Zen/GCN5 based)
Banded Kestrel (R1000 series, Zen/GCN5 based)
2000 series
Grey Hawk (V2000 series, Zen 2/GCN5 based)
River Hawk (R2000 series, Zen+ based)
3000 series
(V3000 series, Zen 3 based)
7000 series
(Ryzen Embedded 7000 series, Zen 4/RDNA2 based)
Common features of Ryzen Embedded 7000 series CPUs:
- Socket: AM5.
- All the CPUs support ECC DDR5-5200 dual-channel mode.
- L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
- L2 cache: 1 MB per core.
- All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
- Includes integrated RDNA 2 GPU with 2 CUs and boost clock speeds of 2200 MHz.
- Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).
See also
- Table of AMD processors
- List of AMD Athlon processors
- List of AMD processors with 3D graphics
- List of AMD CPU microarchitectures
- List of AMD chipsets