List of AMD processors with 3D graphics

This is a list of microprocessors designed by AMD containing a 3D integrated graphics processing unit (iGPU), including those under the AMD APU (Accelerated Processing Unit) product series.

The following table shows features of AMD's processors with 3D graphics, including APUs.

The following table shows the graphics and compute APIs support across ATI/AMD GPU microarchitectures. Note that a branding series might include older generation chips.

• Socket FM1
• CPU: K10 (also Husky or K10.5) cores with an upgraded Stars architecture, no L3 cache
  • L1 cache: 64 KB Data per core and 64 KB Instruction cache per core
  • L2 cache: 512 KB on dual-core, 1 MB on tri- and quad-core models
  • MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, Cool'n'Quiet, AMD-V
• GPU: TeraScale 2 (Evergreen); all A and E series models feature Redwood-class integrated graphics on die (BeaverCreek for the dual-core variants and WinterPark for the quad-core variants). Sempron and Athlon models exclude integrated graphics.
• List of embedded GPU's
• Support for up to four DIMMs of up to DDR3-1866 memory
• Fabrication 32 nm on GlobalFoundries SOI process; Die size: 228 mm², with 1.178 billion transistors
• 5 GT/s UMI
• Integrated PCIe 2.0 controller
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Select models support Hybrid Graphics technology to assist a discrete Radeon HD 6450, 6570, or 6670 discrete graphics card. This is similar to the Hybrid CrossFireX technology available in the AMD 700 and 800 chipset series

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• CPU: Piledriver
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU TeraScale 3 (VLIW4)
• Die Size: 246 mm², 1.303 Billion transistors
• Support for up to four DIMMs of up to DDR3-1866 memory
• 5 GT/s UMI
• GPU (based on VLIW4 architecture) instruction support: DirectX 11, Opengl 4.2, DirectCompute, Pixel Shader 5.0, Blu-ray 3D, OpenCL 1.2, AMD Stream, UVD3
• Integrated PCIe 2.0 controller, and Turbo Core technology for faster CPU/GPU operation when the thermal specification permits
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• Sempron and Athlon models exclude integrated graphics
• Select models support Hybrid Graphics technology to assist a Radeon HD 7350, 7450, 7470, 7550, 7570, 7670 discrete graphics card. However, it has been found that this does not always improve 3D accelerated graphics performance.

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FM2
• Two or four CPU cores based on the Piledriver microarchitecture
  • Die Size: 246 mm², 1.303 Billion transistors
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, AVX, AVX1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core 3.0, NX bit, PowerNow!
• GPU
  • TeraScale 3 architecture
  • HD Media Accelerator, AMD Hybrid Graphics

• Fabrication 28 nm by GlobalFoundries
• Socket AM1, aka Socket FS1b (AM1 platform)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• SoC with integrated memory, PCIe, 2× USB 3.0, 6× USB 2.0, Gigabit Ethernet, and 2× SATA III (6 Gb/s) controllers
• GPU based on Graphics Core Next (GCN)

• Fabrication 28 nm by GlobalFoundries.
• Socket FM2+, support for PCIe 3.0.
• Two or four CPU cores based on the Steamroller microarchitecture.
  • Kaveri refresh models have codename Godavari.
• Die Size: 245 mm², 2.41 Billion transistors.
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module.
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on GCN 2nd gen microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs).
• Heterogeneous System Architecture-enabled zero-copy through pointer passing.
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio.
• Dual-channel (2× 64 Bit) DDR3 memory controller.
• Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions in select APU models, except the Performance APU models.
• Select models support Hybrid Graphics technology by using a Radeon R7 240 or R7 250 discrete graphics card.
• Display controller: AMD Eyefinity 2, 4K Ultra HD support, DisplayPort 1.2 Support.

• Fabrication: 28 nm by GlobalFoundries
• Socket FM2+ or AM4, support for PCIe 3.0
• Two or four CPU cores based on the Excavator microarchitecture
• Die size: 250.04 mm², 3.1 billion transistors
• L1 cache: 32 KB data per core and 96 KB instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Single- or dual-channel DDR3 or DDR4 memory controller
• Third generation GCN-based GPU (Radeon M300)
• Integrated custom ARM Cortex-A5 coprocessor with TrustZone security extensions

• Fabrication 28 nm by GlobalFoundries
• Socket AM4, support for PCIe 3.0
• Two or four "Excavator+" CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• PCI Express 3.0 x8 (No Bifurcation support, requires a PCI-e switch for any configuration other than x8)
• PCI Express 3.0 x4 as link to optional external chipset
• 4x USB 3.1 Gen 1
• Storage: 2x SATA and 2x NVMe or 2x PCI Express
• Third Generation GCN based GPU with hybrid VP9 decoding

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Common features of Zen based Raven Ridge desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2666 (DDR4-2933 Ryzen) in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 14LP.

• Fabrication 12 nm by GlobalFoundries
• Transistors: 4.94 billion
• Die size: 210 mm²
• Socket AM4
• Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN based GPU
• Video Core Next (VCN) 1.0

Common features of Zen+ based desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-2933 in dual-channel mode, while Athlon Pro 300GE and Athlon Silver Pro 3125GE support only DDR4-2666.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP.

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 2 CPU cores
• Dual-channel DDR4 memory controller

Common features of Ryzen 4000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

• Fabrication 7 nm by TSMC
• Socket AM4
• Up to eight Zen 3 CPU cores
• Dual-channel DDR4 memory controller

Common features of Ryzen 5000 desktop APUs:

• Socket: AM4.
• All the CPUs support DDR4-3200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 24 PCIe 3.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

• Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
• Socket AM5
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller

• Basic iGPU

Common features of Ryzen 7000 desktop CPUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• All the CPUs support 28 PCIe 5.0 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost). Models with "F" suffixes are without iGPUs.
• Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O die).

Common features of Ryzen 8000G desktop APUs:

• Socket: AM5.
• All the CPUs support DDR5-5200 RAM in dual-channel mode in 2x1R and 2x2R configuration, but only DDR5-3600 for 4x1R and 4x2R.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 1 MB per core.
• Models with Zen 4c cores (codenamed Phoenix 2) support 14 PCIe 4.0 lanes, while models without them support 20 lanes. 4 of the lanes are reserved as link to the chipset.
• Includes integrated RDNA 3 GPU.
• Includes XDNA AI Engine (Ryzen AI) on models without Zen 4c cores.
• Fabrication process: TSMC 4 nm FinFET.

• Fabrication 28 nm
• Socket FT3 (BGA)
• 4 CPU Cores (Jaguar & Puma microarchitecture)
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Single-channel DDR3 memory controller
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on 2nd generation Graphics Core Next (GCN) architecture

• Fabrication 28 nm
• Socket FP4 (BGA)
• Two or Four CPU cores based on the Excavator microarchitecture
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• Dual-channel DDR4 memory controller
• GPU based on 3rd generation Graphics Core Next (GCN) architecture

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1
• Upgraded Stars (AMD 10h architecture) codenamed Husky CPU cores (K10.5) with no L3 cache, and with Redwood-class integrated graphics on die
• L1 Cache: 64 KB Data per core and 64 KB Instructions per core(BeaverCreek for the dual-core variants and WinterPark for the quad-core variants)
• Integrated PCIe 2.0 controller
• GPU: TeraScale 2
• Select models support Turbo Core technology for faster CPU operation when the thermal specification permits
• Support for 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified
• 2.5 GT/s UMI
• MMX, Enhanced 3DNow!, SSE, SSE2, SSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Based on the Piledriver architecture
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
• 2.5 GT/s UMI
• Transistors: 1.303 billion
• Die size: 246 mm²

• Fabrication 32 nm on GlobalFoundries SOI process
• Socket FS1r2, FP2
• Elite Performance APU.
• CPU: Piledriver architecture
  • L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• GPU: TeraScale 3 (VLIW4)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 CPU cores with 4 MB of L2 cache.
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM, Turbo Core
• Three to eight Compute Units (CUs) based on Graphics Core Next (GCN) microarchitecture; 1 Compute Unit (CU) consists of 64 Unified Shader Processors : 4 Texture Mapping Units (TMUs) : 1 Render Output Unit (ROPs)
• AMD Heterogeneous System Architecture (HSA) 2.0
• SIP blocks: Unified Video Decoder, Video Coding Engine, TrueAudio
• Dual-channel (2x64-bit) DDR3 memory controller
• Integrated custom ARM Cortex-A5 co-processor with TrustZone Security Extensions

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2

• Fabrication 28 nm
• Socket FP4
• Two or four "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 1.2 with VP9 decoding

• Fabrication 14 nm by GlobalFoundries
• Transistors: 4.94 billion
• Socket FP5
• Die size: 210 mm²
• Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Fifth generation GCN-based GPU

• Fabrication 12 nm by GlobalFoundries
• Socket FP5
• Die size: 210 mm²
• Up to four Zen+ CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel DDR4 memory controller
• Fifth generation GCN-based GPU

Common features of Ryzen 3000 notebook APUs:

• Socket: FP5.
• All the CPUs support DDR4-2400 in dual-channel mode.
• L1 cache: 96 KB (32 KB data + 64 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: GlobalFoundries 12LP (14LP+).

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die
• Up to eight Zen 2 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 156 mm²
• 9.8 billion transistors on one single 7 nm monolithic die
• Up to eight Zen 2 CPU cores
• Fifth generation GCN-based GPU (7 nm Vega)

Common features of Ryzen 5000 notebook APUs:

• Socket: FP6.
• All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 3.0 lanes.
• Includes integrated GCN 5th generation GPU.
• Fabrication process: TSMC 7FF.

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

• Fabrication 7 nm by TSMC
• Socket FP6
• Die size: 180 mm²
• Up to eight Zen 3 CPU cores
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• Fifth generation GCN-based GPU
• Memory support: DDR4-3200 or LPDDR4-4266 in dual-channel mode.
• All the CPUs support 16 PCIe 3.0 lanes.

• Fabrication 6 nm by TSMC
• Socket FP7
• Die size: 210 mm²
• Up to eight Zen 3+ CPU cores
• Second generation RDNA-based GPU

Common features of Ryzen 6000 notebook APUs:

• Socket: FP7, FP7r2.
• All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 16 PCIe 4.0 lanes.
• Native USB 4 (40Gbps) Ports: 2
• Native USB 3.2 Gen 2 (10Gbps) Ports: 2
• Includes integrated RDNA 2 GPU.
• Fabrication process: TSMC N6 FinFET.

• Fabrication 4 nm by TSMC
• Up to eight Zen 4 CPU cores
• Dual-channel DDR5 or LPDDR5x memory controller
• RDNA3 iGPU
• XDNA accelerator

• Fabrication 5 nm (CCD) and 6 nm (cIOD) by TSMC
• Up to sixteen Zen 4 CPU cores
• Dual-channel DDR5 memory controller
• Basic RDNA2 iGPU

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics with UVD 3.0
• Z-series denote Desna; C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• C-series denote Ontario; and the E-series denotes Zacate
• 2.50 GT/s UMI (PCIe 1.0 ×4)

• Fabrication 40 nm by TSMC
• Socket FT1 (BGA-413)
• Based on the Bobcat microarchitecture
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• Found in tablet computers
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• PowerNow!
• DirectX 11 integrated graphics
• 2.50 GT/s UMI (PCIe 1.0 ×4)

• Fabrication 28 nm by TSMC
• Socket FT3 (BGA)
• 2 to 4 CPU Cores (Jaguar (microarchitecture))
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Turbo Dock Technology, C6 and CC6 low power states
• GPU based on Graphics Core Next (GCN)
• AMD Eyefinity multi-monitor for up to two displays

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA)
• CPU: 2 to 4 (Puma cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution

• Fabrication 28 nm by GlobalFoundries
• Socket FT3b (BGA), FP4 (μBGA)
• CPU: 2 to 4 (Puma+ cores)
  • L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• GPU based on Graphics Core Next (GCN)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• Intelligent Turbo Boost
• Platform Security Processor, with an integrated ARM Cortex-A5 for TrustZone execution
• All models except A8-7410 available in both laptop and all-in-one desktop versions

• Fabrication 28 nm by GlobalFoundries
• Socket FP4 / FT4
• 2 "Excavator+" x86 CPU cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• Single-channel DDR4 memory controller
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND, Turbo Core
• GPU based on Graphics Core Next 3rd Generation with VP9 decoding

• Fabrication 14 nm by GlobalFoundries
• Socket FP5
• Two Zen CPU cores
• Over 30% die size reduction over predecessor (Raven Ridge)
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual-channel RAM

• Fabrication 14 nm by GlobalFoundries
• Socket FT5
• Two Zen CPU cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Single-channel RAM

Common features:

• Socket: FT6
• All the CPUs support LPDDR5-5500 in dual-channel mode.
• L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
• L2 cache: 512 KB per core.
• All the CPUs support 4 PCIe 3.0 lanes.
• Includes integrated RDNA2 GPU.
• Fabrication process: TSMC 6 nm FinFET.

• Fabrication 40 nm
• Socket FT1 (BGA-413)
• CPU microarchitecture: Bobcat
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, AMD-V
• GPU microarchitecture: TeraScale 2 (VLIW5) "Evergreen"
• Memory support: single-channel, support up to two DIMMs of DDR3-1333 or DDR3L-1066
• 5 GT/s UMI

• Fabrication 28 nm
• Socket FT3 (769-BGA)
• CPU microarchitecture: Jaguar
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support. No support for FMA (Fused Multiply-Accumulate). Trusted Platform Module (TPM) 1.2 support
• GPU microarchitecture: Graphics Core Next (GCN) with Unified Video Decoder 3 (H.264, VC-1, MPEG2, etc.)
• Single channel DDR3-1600, 1.25 and 1.35 V voltage level support, support for ECC memory
• Integrates Controller Hub functional block, HD audio, 2 SATA channels, USB 2.0 and USB 3.0 (except GX-210JA)

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• CPU microarchitecture: Puma
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• no GPU

• Fabrication 28 nm
• Socket FT3b (769-BGA)
• 2 Puma x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 32 KB Instructions per core
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AVX, F16C, CLMUL, AES, MOVBE (Move Big-Endian instruction), XSAVE/XSAVEOPT, ABM, BMI1, AMD-V support
• GPU microarchitecture: Graphics Core Next (GCN) (1CU) with support for DirectX 11.2
• Single channel 64-bit DDR3 memory with ECC
• Integrated Controller Hub supports: PCIe® 2.0 4×1, 2 USB3 + 4 USB2 ports, 2 SATA 2.0/3.0 ports

• Fabrication 28 nm
• Socket FP4
• 2 or 4 Excavator x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 4 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• 4K × 2K H.265 decode capability and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

• Fabrication 28 nm
• Socket FP4
• 2 "Excavator+" x86 cores with 1MB shared L2 cache
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Radeon R5E Graphics Core Next (GCN) (up to 3 CUs) with support for DirectX 12
• Single channel 64-bit DDR4 or DDR3 memory
• 4K × 2K H.265 decode capability with 10-bit compatibility and multi format encode and decode
• Integrated Controller Hub supports: PCIe 3.0 1×4, PCIe 2/3 4×1, 2 USB3 + 2 USB2 ports, 2 SATA 2.0/3.0 ports

• Fabrication 32 nm
• Socket FP2 (BGA-827), FS1r2
• CPU microarchitecture: Piledriver
• L1 Cache: 16 KB Data per core and 64 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• GPU microarchitecture: TeraScale 3 (VLIW4) "Northern Islands"
• Memory support: dual-channel 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3
• 2.5 GT/s UMI
• Die size: 246 mm²; Transistors: 1.303 billion
• OpenCL 1.1 and OpenGL 4.2 support

• Fabrication 28 nm
• Socket FP3
• Up to 4 Steamroller x86 cores
• L1 Cache: 16 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4a, SSE4.1, SSE4.2, AMD64, AMD-V, AES, CLMUL, AVX 1.1, XOP, FMA3, FMA4, F16C, ABM, BMI1, TBM
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 11.1 and OpenGL 4.2
• Dual channel DDR3 memory with ECC
• Unified Video Decode (UVD) 4.2 and Video Coding Engine (VCE) 2.0

• Fabrication 28 nm
• Socket FP4
• Up to 4 Excavator x86 cores
• L1 Cache: 32 KB Data per core and 96 KB Instructions per module
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, XOP, FMA3, FMA4, F16C, ABM, BMI1, BMI2, TBM, RDRAND
• GPU microarchitecture: Graphics Core Next (GCN) (up to 8 CUs) with support for DirectX 12
• Dual channel 64-bit DDR4 or DDR3 memory with ECC
• Unified Video Decode (UVD) 6 (4K H.265 and H.264 decode) and Video Coding Engine (VCE) 3.1 (4K H.264 encode)
• Dedicated AMD Secure Processor supports secure boot with AMD Hardware Validated Boot (HVB)
• Integrated FCH featuring PCIe 3.0 USB3.0, SATA3, SD, GPIO, SPI, I2S, I2C, UART

• Fabrication 14 nm by GlobalFoundries
• Up to 4 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

• Fabrication 14 nm by GlobalFoundries
• Up to 2 Zen cores
• Socket FP5
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core
• Dual channel DDR4 memory with ECC
• Fifth generation GCN based GPU

• Fabrication 7 nm by TSMC
• Up to 8 Zen 2 cores
• Fifth generation GCN based GPU

• Fabrication 12 nm by GlobalFoundries
• Up to 4 Zen+ cores
• MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, AVX2, FMA3, F16C, ABM, BMI1, BMI2, RDRAND, Turbo Core

As of May 1, 2013, AMD opened the doors of their "semi-custom" business unit. Since these chips are custom-made for specific customer needs, they vary widely from both consumer-grade APUs and even the other custom-built ones. Some notable examples of semi-custom chips that have come from this sector include the chips from the PlayStation 4 and Xbox One. So far the size of the integrated GPU in these semi-custom APUs exceed by far the GPU size in the consumer-grade APUs.

• List of AMD chipsets
• List of AMD FX microprocessors
• List of AMD graphics processing units
• Ryzen

• AMD Accelerated Processing Units official website
• Technical specification AMD products
• AMD products and technologies