List of AMD mobile processors

Features overview

CPUs

APUs

APU features table

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Dublin" (Socket 754, CG, 130 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Sonora" (Socket 754, D0, 90 nm, Low power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

"Roma" (Socket 754, E6, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"ClawHammer" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Odessa" (CG, 130 nm, Desktop replacement)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Odessa" (CG, 130 nm, 35 W TDP)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Newark" (E5, 90 nm, 62 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Turion 64

"Lancaster" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Kite platform (2006)

Introduced in 2006, the Kite platform consists of:

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Turion 64

"Richmond" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion 64 X2

"Taylor" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

"Trinidad" (90 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Kite Refresh platform (2007)

AMD used Kite Refresh as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64

Athlon 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion 64 X2

"Tyler" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Puma platform (2008)

The Puma platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

Mobile Sempron

"Sable" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!

Athlon X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion X2

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Turion X2 Ultra

"Lion" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V

Yukon platform (2009)

The Yukon platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

Sempron

"Huron" (65 nm, Low power)

  • Both models support: MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64
  • Sempron 210U supports extra AMD-V

Athlon Neo

"Huron" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V

"Sherman" (65 nm, 15 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

"Congo" (65 nm, 13 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Turion

"Congo" (65 nm, 20 W TDP)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!

Congo platform (2009)

The Congo platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

Athlon Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V

Turion Neo X2

"Conesus" (65 nm)

MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!

Tigris platform (2009)

The Tigris platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

Sempron

"Caspian" (45 nm)

Single-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Athlon II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Turion II

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor

MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V


Nile platform (2010)

The Nile platform introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of:

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor


Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor

Dual-core mobile processor


Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor


Danube platform (2010)

The Danube platform introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of:

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor


Athlon II

Champlain (45 nm)

Dual-core mobile processor


Turion II

Champlain (45 nm)

Dual-core mobile processor


Phenom II

  • MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V
  • Unlike desktop models, mobile Phenom II-based models do not have L3 cache
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor


Triple-core mobile processors


Quad-core mobile processors


Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (Microsoft programming interface for GPU computing) and OpenCL (cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:

"Ontario" (40 nm)

"Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz)
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)

Sabine (Fusion) platform (2011)

The Sabine platform introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

"Llano" (32 nm)

  • SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core
  • Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.148 billion
  • Die size: 228 mm²

1 Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

"Ontario", "Zacate" (40 nm)

  • SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V
  • Single-channel DDR3 SDRAM, DDR3L SDRAM
  • 2.5 GT/s UMI.
  • Config GPU are Unified shaders : Texture mapping units : Render output units
  • Socket FT1 (BGA-413)

Comal (Fusion) platform (2012)

The Comal platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

"Trinity" (2012, 32 nm)

1 Config GPU are Unified shaders : Texture mapping units : Render output units

"Richland" (2013, 32 nm)

  • Elite Performance APU.
  • MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core
  • Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V DDR3 memory specified (Dual-channel)
  • 2.5 GT/s UMI.
  • Transistors: 1.303 billion
  • Die size: 246 mm²

1 Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

"Temash" (2013, 28 nm)

Elite Mobility APU:

1 Unified shaders : Texture mapping units : Render output units

"Kabini" (2013, 28 nm)

Mainstream APU:

1 Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

Kaveri (2014)

Carrizo-L (2015)

Carrizo (2015)

Bristol Ridge (2016)

"Raven Ridge" (2017)

"Picasso" (2019)

Common features of Ryzen 3000 notebook APUs:

"Renoir" (2020)

U

H

"Lucienne" (2021)

Common features of Ryzen 5000 notebook APUs:

"Cezanne" (2021)

U

H

"Barceló" (2022)

"Rembrandt" (2022)

Common features of Ryzen 6000 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.

Mendocino (7020 series, Zen2/RDNA2 based)

Common features of Ryzen 7020 notebook APUs:

  • Socket: FT6
  • All the CPUs support LPDDR5-5500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 4 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 1
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.


Barcelo-R (7030 series, Zen3/GCN5 based)

Common features of Ryzen 7030 notebook APUs:

  • Socket: FP6.
  • All the CPUs support DDR4-3200 or LPDDR4-4266 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 3.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated GCN 5th generation GPU.
  • Fabrication process: TSMC N7 FinFET.

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Common features of Ryzen 7035 notebook APUs:

  • Socket: FP7, FP7r2.
  • All the CPUs support DDR5-4800 or LPDDR5-6400 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 512 KB per core.
  • All the CPUs support 16 PCIe 4.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 2 GPU.
  • Fabrication process: TSMC N6 FinFET.

Phoenix (7040 series, Zen4/RDNA3 based)

Common features of Ryzen 7040 notebook APUs:

  • Socket: FP7, FP7r2, FP8.
  • All the CPUs support DDR5-5600 or LPDDR5X-7500 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All models support AVX-512 using a half-width 256-bit FPU.
  • PCIe 4.0 support.
  • Native USB 4 (40Gbps) Ports: 2
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 2
  • Includes integrated RDNA 3 GPU.
  • Includes XDNA AI Engine (Ryzen AI).
  • Fabrication process: TSMC N4 FinFET.

Dragon Range (7045 series, Zen4/RDNA2 based)

Common features of Ryzen 7045 notebook CPUs:

  • Socket: FL1.
  • All the CPUs support DDR5-5200 in dual-channel mode.
  • L1 cache: 64 KB (32 KB data + 32 KB instruction) per core.
  • L2 cache: 1 MB per core.
  • All the CPUs support 28 PCIe 5.0 lanes.
  • Native USB 4 (40Gbps) Ports: 0
  • Native USB 3.2 Gen 2 (10Gbps) Ports: 4
  • Includes integrated RDNA 2 GPU on the I/O die with 2 CUs and clock speeds of 400 MHz (base), 2.2 GHz (boost).
  • Fabrication process: TSMC N5 FinFET (N6 FinFET for the I/O and graphics die).

See also

References

Retrieved from "https://en.wikipedia.org/w/index.php?title=List_of_AMD_mobile_processors&oldid=1222941772"
Uses material from the Wikipedia article List of AMD mobile processors, released under the CC BY-SA 4.0 license.