List of Intel Core processors

The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture, as well as its Core 2- (Solo/Duo/Quad/Extreme), Core i3-, Core i5-, Core i7-, Core i9-, Core M- (m3/m5/m7/m9), Core 3-, Core 5-, and Core 7- Core 9-, branded processors.

Desktop processors

Core 2

"Allendale" (65 nm, 800 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
Die size: 111 mm²
Steppings: L2^b, M0^c, G0^d

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
All models support: Intel VT-x
Die size: 143 mm²
Steppings: B2, G0

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)^a
All models support: Intel VT-x
All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm²
Transistor count: 291 million
Steppings: B2, G0

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 111 mm² (Conroe)
Steppings: ?

"Conroe XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm²
Steppings: B1, B2
The X6900 was never publicly released.

"Kentsfield" (65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm²
Steppings: B3, G0

"Kentsfield XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm²
Steppings: B3, G0

"Wolfdale-3M" (45 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Die size: 82 mm²
Transistor Count: 230 million
Steppings: M0, R0
Models with a part number ending in "ML" instead of "M" support Intel VT-x

"Wolfdale" (45 nm, 1333 MT/s)

All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x^[a], Intel VT-d^[b], Trusted Execution Technology (TXT)
Die size: 107 mm²
Transistor Count: 410 million
Steppings: C0, E0

^a Note: The E8190 and E8290 do not support Intel VT-d.

Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM, but none was offered in retail PCs.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x^[a], Intel VT-d^[b], Trusted Execution Technology (TXT)^[c]
Die size: 2 × 82 mm²
Steppings: M0, M1, R0
All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

^a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

^b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

^c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
Die size: 2 × 107 mm²
The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
Steppings: C0, C1, E0

"Yorkfield XE" (45 nm)

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
Intel VT-d supported by: QX9650
Die size: 2 × 107 mm²
Steppings: C0, C1, E0
The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

Core i (1st gen)

Lynnfield

Common features:

Socket: LGA 1156.
All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Bloomfield

Common features:

Socket: LGA 1366.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge).
- Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
Extreme Edition processors have an unlocked multiplier and can be overclocked.

Clarkdale

Common features:

Socket: LGA 1156.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Gulftown

Common features:

Socket: LGA 1366.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge).
- Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (2nd gen)

Sandy Bridge-DT

Common features:

Socket: LGA 1155.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-2120, i5-2400, and i7-2600 are available as embedded processors.
The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Core i (3rd gen)

Ivy Bridge-DT

Common features:

Socket: LGA 1155.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Sandy Bridge-E

Common features:

Socket: LGA 2011.
All the CPUs support quad-channel DDR3-1600 RAM.
All CPU models provide 40 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (4th gen)

Haswell-DT

Common features:

Socket: LGA 1150.
All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Haswell-H

Common features:

Socket: BGA 1364 (soldered).
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 22 nm.

Ivy Bridge-E

Common features:

Socket: LGA 2011.
All the CPUs support quad-channel DDR3-1866 RAM.
All CPU models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (5th gen)

Broadwell-H

Common features:

Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Haswell-E

Common features:

Socket: LGA 2011-3.
All the CPUs support quad-channel DDR4-2133 RAM.
i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (6th gen)

Skylake-S

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Skylake-H

Common features:

Socket: BGA 1440 (soldered).
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Broadwell-E

Common features:

Socket: LGA 2011-3.
All the CPUs support quad-channel DDR4-2400 RAM.
i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (7th gen)

Kaby Lake-S

Common features:

Socket: LGA 1151.
All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Skylake-X

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Kaby Lake-X

Common features:

Socket: LGA 2066.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Core i (8th gen)

Coffee Lake-S

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Core i (9th gen)

Coffee Lake-R

Common features:

Socket: LGA 1151-2.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9-9900KS has all-core boost clock of 5.0 GHz.

Skylake-X (9xxx)

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2666 RAM.
All CPU models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Core i (10th gen)

Comet Lake-S

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
All models support Turbo Boost 2.0.

Cascade Lake-X (10xxx)

Common features:

Socket: LGA 2066.
All the CPUs support quad-channel DDR4-2933 RAM.
All CPU models provide 48 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Core i (11th gen)

Rocket Lake-S

Common features:

Socket: LGA 1200.
All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Tiger Lake-B

Common features:

Socket: BGA 1787 (soldered).
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
These CPUs were sold to OEMs only.

Core i (12th gen)

Alder Lake-S

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 1.25 MB per core.
- E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (13th gen)

Raptor Lake-S

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models.
- E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core i (14th gen)

Raptor Lake-S Refresh

Common features:

Socket: LGA 1700.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
- E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache:
- P-cores: 2 MB per core on i5-14600/T/K/KF and above models, 1.25 MB per core on 14500 and below models.
- E-cores: 4 MB per E-core cluster on i5-14600/T/K/KF and above models, 2 MB per cluster on 14500 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Core Ultra (Series 2)

Arrow Lake-S

Common features:

Socket: LGA 1851.
All the CPUs support up to dual-channel DDR5-5600 (UDIMM) or DDR5-6400 (CUDIMM) RAM.
All the CPUs provide 20 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache:
- P-cores: 112 KB (48 KB (12-Way) data + 64 KB (16-Way) instructions) per core.
- E-cores: 96 KB (32 KB (8-Way) data + 64 KB (16-Way) instructions) per core.
L2 cache:
- P-cores: 3 MB (12-Way) per core.
- E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.
K-suffix processors have an unlocked multiplier and can be overclocked.
Core Ultra 9 and Core Ultra 7 models support Turbo Boost 3.0 on the P-cores, while Core Ultra 5 models only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Mobile processors

Core

Yonah

Core 2

Inside of old Sony VAIO laptop (VGN-C140G)

"Merom-L" (65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 81 mm²
Steppings: A1

"Merom", "Merom-2M" (standard-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 143 mm² (Merom), 111 mm² (Merom-2M)
Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
Die size: 143 mm²
Steppings: B2, E1, G0, G2

"Merom-2M" (ultra-low-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 111 mm²
Steppings: L2, M0

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
Die size: 143 mm²
Steppings: E1, G0

"Penryn-L" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 82 mm²
228 million transistors
Package size: 22 mm × 22 mm
Steppings: M0, R0

"Penryn" (Apple iMac specific, 45 nm)

Die size: 107 mm²
The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
Steppings: C0, E0

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
All T9xxx models support Trusted Execution Technology (TXT)
T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Select Apple subsets of P7000 series processors support Intel VT-x.
Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
Die size: 107 mm² (Penryn), 82 mm² (Penryn-3M)
Package size: 35 mm × 35 mm
Transistors: 410 million
Steppings: (Core microarchitecture 45nm steppings)
- C0, E0 (Penryn)
- M0, R0 (Penryn-3M)
- stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform
- stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn" (low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: C0, E0

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
Die size: 107 mm²
Package size: 22 mm × 22 mm
Steppings: M0, R0

"Penryn XE" (45 nm)

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
Die size: 107 mm²
Steppings: C0, E0

"Penryn QC" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Die size: 2 × 107 mm²
Steppings: E0

"Penryn QC XE" (45 nm)

This model features an unlocked clock multiplier usually manipulated through the systems BIOS however some manufacturers (such as HP) do not have this feature enabled on their laptops that use this processor.
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Package size: 35 mm × 35 mm
Die size: 2 × 107 mm²
Steppings: E0