{"version":"1.0","type":"link","title":"Ball grid array - Newikis","description":"A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom…","provider_name":"Newikis","provider_url":"https://newikis.com","cache_age":86400,"thumbnail_url":"https://thumb.wikimedia.org/wikipedia/commons/thumb/8/8a/Solder_ball_grid.jpg/1280px-Solder_ball_grid.jpg","thumbnail_width":1280,"thumbnail_height":960}