| Semiconductor device fabrication |
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MOSFET scaling (process nodes) |
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Future
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The 10 μm process (10 micrometer process) is the level of MOSFET semiconductor process technology that was commercially reached around 1971, by companies such as RCA and Intel.
The 10 μm process refers to the minimum size that could be reliably produced: the half-pitch, which is the distance between two 1-metal lanes, center to center, and the gate length of a transistor; those two values used to be identical in early nodes. The smallest transistors and other circuit elements on a chip made with this process were around 10 micrometers wide.
The i1103 was manufactured on a 6-mask silicon-gate P-MOS process with 8 μm minimum features. The resulting product had a 2,400 μm, 2 memory cell size, a die size just under 10 mm2, and sold for around $21.
| Preceded by 20 μm process |
MOSFET semiconductor device fabrication process | Succeeded by 6 μm process |