DO-204

DO-204 is a family of diode semiconductor packages defined by JEDEC. This family comprises lead-mounted axial devices with round leads. Generally a diode will have a line painted near the cathode end.

Dimensions

Variants included in DO-204
		min	max	min	max	min	max	min	max	min	max
Variant	Original standard	Dimensions (mm)
		A		B		C		D		E
AA	DO-7	25.40	38.10	5.85	7.62	0.46	0.55	2.16	2.71	—	1.27
AB	DO-14	25.40	38.10	5.85	7.62	0.46	0.55	2.75	3.55	—	1.27
AC	DO-15	25.40	38.10	5.85	7.62	0.69	0.88	2.65	3.55	—	1.27
AD	DO-16	11.43	19.05	1.27	2.54	0.23	0.33	—	1.27	—	1.27
AE	DO-26	35.56	38.10	8.75	10.41	0.69	0.99	5.59	6.60	—	2.03
AF	DO-29	25.40	38.10	8.00	9.14	0.74	0.83	3.05	3.81	—	1.27
AG	DO-34	25.40	38.10	2.16	3.04	0.46	0.55	1.27	1.90	—	1.27
AH	DO-35	25.40	38.10	3.05	5.08	0.46	0.55	1.53	2.28	—	1.27
AJ	—	11.43	13.97	5.85	7.62	0.49	0.53	2.16	2.66	—	1.27
AK	—	11.43	13.97	3.81	4.45	0.36	0.40	1.66	1.90	—	1.27
AL	DO-41	25.40	—	4.07	5.20	0.72	0.86	2.04	2.71	—	1.27
AM	—	17.53	38.10	3.18	5.20	0.64	0.91	1.27	2.79	—	1.27
AN	—	25.40	—	5.08	5.84	0.71	0.86	2.54	3.05	—	1.27
AP	—	25.40	38.10	3.18	4.57	0.74	0.89	2.54	3.81	—	1.27
AR	—	27.95	38.10	9.27	9.52	1.22	1.32	6.10	6.35	—	2.54

Common variants

Several common packages are archived in DO-204 as variants, and may be referred to using their alternative names.

DO-7

The DO-7 (also known as DO-204-AA) is a common semiconductor package for 1N34A germanium diodes.

DO-35

The DO-35 (also known as DO-204-AH or SOD27) is a semiconductor package used to encapsulate signal diodes (i.e., diodes meant to handle small amounts of current and voltage). It is often used to package small signal, low power diodes such as 1N4148 (a 100 V, 300 mA silicon diode.)

DO-41

The DO-41 (also known as DO-204-AL or SOD66) is a common semiconductor package used to encapsulate rectifier diodes (i.e., diodes meant to handle larger currents and voltages than signal diodes). The name is derived from the JEDEC descriptor "Diode Outline, Case Style 41". DO-41 diodes are larger than signal diode packages such as DO-35, which are not required to handle large currents. The most common diode using this packaging is the 1N4001 to 1N4007 series of rectification diodes.

National standards

Standards organization	Standard	Designation for
Standards organization	Standard	DO-7	DO-14	DO-15	DO-16	DO-29	DO-35	DO-41
JEDEC	JEP95	DO-204AA	DO-204AB	DO-204AC	DO-204AD	DO-204AF	DO-204AH	DO-204AL
IEC	IEC 60191	A1A	A1C	A58	A70	A71	A24
DIN	DIN 41880	51A2				—	54A2	54B2
DIN	DIN 41883	—				56A2	—	—
EIAJ / JEITA	ED-7500A	SC-1A	—	SC-39	SC-54	SC-55	SC-40	—
British Standards	BS 3934	SO-6	SO-8				SO-84
ASMW	TGL 200-8380	B	—	D5	D6	—	K	—
ASMW	TGL 11811	M3A	—	M3B	M3C	—	M2	—

References

↑ "JEDEC DO-204 family package specification" (PDF). JEDEC. January 20, 1976. Archived from the original (PDF) on October 10, 2008.
1 2 3 "Master Index for JEDEC 95 Outlines and Standards" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017. Retrieved June 16, 2017.
1 2 "JEDEC DO-7 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
↑ "JEDEC DO-14 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
↑ "JEDEC DO-15 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
↑ "JEDEC DO-16 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
↑ "JEDEC DO-26 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
↑ "JEDEC DO-29 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
↑ "JEDEC DO-34 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
1 2 "JEDEC DO-35 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.
1 2 "JEDEC DO-41 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.
↑ DO-7 diode package; Interface Bus.
↑ DO-35 diode package; Interface Bus.
↑ DO-41 diode package; Interface Bus.
1 2 "Semiconductors" (PDF). Pro Electron. 1978. pp. 215–221. Retrieved 2021-06-17.
1 2 "TGL 26713/12: Gehäuse für Halbleiterbauelemente - Bauform M" [Outline drawings for semiconductor devices; Type M] (PDF) (in German). Leipzig: Verlag für Standardisierung. June 1988. Retrieved 2021-06-15.
↑ "Semiconductor Databook" (PDF). Heilbronn: AEG-Telefunken. p. 8. Retrieved 2021-08-20.
1 2 "Diodes - Zener Diodes - Rectifiers - Thyristors" (PDF). Freiburg: ITT. 1977. p. 218. Retrieved 2021-11-05.
↑ "EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices" (PDF). JEITA. 1996. Retrieved 2021-06-14.
↑ "TGL 200-8380: Halbleiterbauelemente - Halbleiterdioden Verlustleistung unter 1 Watt - Bauformen" [Semiconductor Devices - Designs for Semiconductor Diodes - Dissipation power less 1 Watt] (PDF) (in German). Leipzig: Verlag für Standardisierung. 1981. Retrieved 2021-07-12.

External links

JEP95 - Registered and Standard Outlines for Solid State and Related Products, JEDEC
DO family parts, TopLine

[DO-204_Spec-1] "JEDEC DO-204 family package specification" (PDF). JEDEC. January 20, 1976. Archived from the original (PDF) on October 10, 2008.

[JEDEC_95_Index-2] 1 2 3 "Master Index for JEDEC 95 Outlines and Standards" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017. Retrieved June 16, 2017.

[DO-7_Spec-3] 1 2 "JEDEC DO-7 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.

[DO-14_Spec-4] "JEDEC DO-14 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.

[DO-15_Spec-5] "JEDEC DO-15 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.

[DO-16_Spec-6] "JEDEC DO-16 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.

[DO-26_Spec-7] "JEDEC DO-26 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.

[DO-29_Spec-8] "JEDEC DO-29 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.

[DO-34_Spec-9] "JEDEC DO-34 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.

[DO-35_Spec-10] 1 2 "JEDEC DO-35 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 18, 2017.

[DO-41_Spec-11] 1 2 "JEDEC DO-41 package specification" (PDF). JEDEC. Archived from the original (PDF) on June 17, 2017.

[12] DO-7 diode package; Interface Bus.

[13] DO-35 diode package; Interface Bus.

[14] DO-41 diode package; Interface Bus.

[iec-15] 1 2 "Semiconductors" (PDF). Pro Electron. 1978. pp. 215–221. Retrieved 2021-06-17.

[tgl26713-16] 1 2 "TGL 26713/12: Gehäuse für Halbleiterbauelemente - Bauform M" [Outline drawings for semiconductor devices; Type M] (PDF) (in German). Leipzig: Verlag für Standardisierung. June 1988. Retrieved 2021-06-15.

[17] "Semiconductor Databook" (PDF). Heilbronn: AEG-Telefunken. p. 8. Retrieved 2021-08-20.

[itt-18] 1 2 "Diodes - Zener Diodes - Rectifiers - Thyristors" (PDF). Freiburg: ITT. 1977. p. 218. Retrieved 2021-11-05.

[19] "EIAJ ED-7500A Standards for the Dimensions of Semiconductor Devices" (PDF). JEITA. 1996. Retrieved 2021-06-14.

[20] "TGL 200-8380: Halbleiterbauelemente - Halbleiterdioden Verlustleistung unter 1 Watt - Bauformen" [Semiconductor Devices - Designs for Semiconductor Diodes - Dissipation power less 1 Watt] (PDF) (in German). Leipzig: Verlag für Standardisierung. 1981. Retrieved 2021-07-12.

v t e Semiconductor packages
Single diode	DO-201 (DO-27) DO-204 (DO-7 / DO-26 / DO-35 / DO-41) DO-213 (MELF / SOD-80 / LL34) DO-214 (SMA / SMB / SMC) SOD (SOD-123 / SOD-323 / SOD-523 / SOD-923)
3...5-pin	SOT / TSOT TO-3 (TH / Panel) TO-5 (TH) TO-8 (TH) TO-18 (TH) TO-39 (TH) TO-66 (TH / Panel) TO-92 (TH) TO-126 (TH / Panel) TO-202 (TH / Panel) TO-220 (TH / Panel) TO-247 (TH / Panel) TO-251 (IPAK) (SMT) TO-252 (DPAK) (SMT) TO-262 (I2PAK) (SMT) TO-263 (D2PAK) (SMT) TO-268 (D3PAK) (SMT) TO-273 (Super-220) (SMT) TO-274 (Super-247) (SMT) TO-277 (SMPC, SM-7) (SMT)
Single row	SIP / SIL
Dual row	DFN DIP / DIL Flat Pack MSOP SO / SOIC SOP / SSOP TSOP / HTSOP TSSOP / HTSSOP ZIP
Quad row	LCC QIP / QIL PLCC QFN QFP QUIP / QUIL
Grid array	BGA eWLB LGA PGA
Wafer	COB COF COG CSP Flip Chip PoP QP UICC WL-CSP / WLP
Related topics	Electronic packaging Integrated circuit packaging List of electronic component packaging types Printed circuit board Surface-mount technology Through-hole technology
It is relatively common to find packages that contain other components than their designated ones, such as diodes or voltage regulators in transistor packages, etc.