MIL-STD-883

The MIL-STD-883 standard establishes uniform methods, controls, and procedures for testing microelectronic devices suitable for use within military and aerospace electronic systems including basic environmental tests to determine resistance to deleterious effects of natural elements and conditions surrounding military and space operations; mechanical and electrical tests; workmanship and training procedures; and such other controls and constraints as have been deemed necessary to ensure a uniform level of quality and reliability suitable to the intended applications of those devices. For this standard, the term "devices" includes monolithic, multichip, film and hybrid microcircuits, microcircuit arrays, and the elements from which the circuits and arrays are formed. This standard is intended to apply only to microelectronic devices.

The process of qualifying devices to this standard are conducted using both nondestructive testing and destructive testing. For tests that would destroy or damage the component a representative number from a batch are tested to indicate the performance of other devices from the same batch. Tests are also carried out during the manufacturing process. Due to the testing requirements it is not possible to retrospectively qualify devices to the full MIL-STD-883 standard once they have been released by the manufacturer.

The standard was issued by the Department of Defense, US.

Environmental tests, methods 1001-1034

Mechanical tests, methods 2001-2036

Electrical tests (digital), methods 3001-3024

Electrical tests (linear), methods 4001-4007

Test procedures, methods 5001-5013

References

  1. ↑ "Mil-Std-883F, Department of Defense Test Method Standard: Microcircuits, Test Standards (18 Jun 2004) [S/S By Mil-Std-883G]" (PDF). EverySpec LLC. 2004-06-18. Archived (PDF) from the original on 2021-10-11. Retrieved 2022-11-27.
  2. ↑ "MIL-STD-883 method 2011.9 – Bond strength (destructive bond pull test)".