List of Intel Core embedded processors

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The following is a list of Intel Core embedded processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7), Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Core i (1st gen)

Arrandale

Common features:

  • Socket: BGA 1288.
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 800 MT/s speeds while E- and LE-suffix models support up to 1066 MT/s speeds.
    • All CPUs except for the i3-330E support ECC memory.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 1.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 660UE 2 (4) 1.33 2.40 HD Graphics 166–500 4 MB 18 W August 2010
620LE 2.00 2.80 266–566 25 W January 2010
620UE 1.06 2.13 166–500 18 W
610E 2.53 3.20 500–766 35 W
Core i5 520E 2.40 2.93 3 MB
Core i3 330E 2.13 N/a 500–666

Core i (2nd gen)

Sandy Bridge-DT

The following models from the Sandy Bridge desktop range are available as embedded processors:

  • Core i7-2600
  • Core i5-2400
  • Core i3-2120

See section Desktop processors § Sandy Bridge-DT for full info.

Sandy Bridge-M

Common features:

  • Socket: G2 (2xx0E and 2xx0QE models except i3-2310E), BGA 1023 (all other models).
  • All the CPUs support dual-channel DDR3 RAM. All models support it at 1333 MT/s speeds while i7-2710QE and above support up to 1600 MT/s speeds.
    • All CPUs except for the i3-2330E, i5-2510E & i7-2710QE support ECC memory.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 2715QE 4 (8) 2.1 3.0 HD 3000 650–1200 6 MB 45 W January 2011
2710QE
2655LE 2 (4) 2.2 2.9 650–1000 4 MB 25 W February 2011
2610UE 1.5 2.4 350–850 17 W
Core i5 2515E 2.5 3.1 650–1100 3 MB 35 W
2510E
Core i3 2340UE 1.3 N/a 350–800 17 W June 2011
2330E 2.2 650–1050 35 W
2310E 2.1 February 2011

Gladden

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3-1333 RAM.
  • All CPU models provide 16 lanes of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Smart
Cache		 TDP Release
date
Base Turbo
Core i3 2115C 2 (4) 2.0 N/a 3 MB 25 W Q2 2012

Core i (3rd gen)

Ivy Bridge-DT

The following models from the Ivy Bridge desktop range are available as embedded processors:

  • Core i7-3770
  • Core i5-3550S
  • Core i3-3220

See section Desktop processors § Ivy Bridge-DT for full info.

Ivy Bridge-M

Common features:

  • Socket: G2 (3xx0ME/QE models only), BGA 1023 (all other models and also i5-3610ME, i3-3120ME).
  • All the CPUs support dual-channel DDR3 and DDR3L RAM, at up to 1600 MT/s speed.
    • All CPUs except the i7-3610QE support ECC memory, with ME-suffixed models only supporting it on their BGA-socketed variants.
  • i7 models provide 16 lanes of PCIe 3.0, while i5 models provide 1 lane of PCIe 3.0 and i3 models provide 1 lane of PCIe 2.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 32 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 3615QE 4 (8) 2.3 3.3 HD 4000 650–1000 6 MB 45 W April 2012
3610QE
3612QE 2.1 3.1 35 W
3555LE 2 (4) 2.5 3.2 550–1000 4 MB 25 W June 2012
3517UE 1.7 2.8 350–1000 17 W
Core i5 3610ME 2.7 3.3 650–950 3 MB 35 W
Core i3 3217UE 1.6 N/a 350–900 17 W August 2012
3120ME 2.4 650–900 35 W

Gladden

Common features:

  • Socket: BGA 1284.
  • All the CPUs support dual-channel DDR3 and DDR3L 1333 MT/s RAM.
  • All CPU models provide 20 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • No integrated graphics.
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Smart
Cache		 TDP Release
date
Base Turbo
Core i3 3115C 2 (4) 2.5 N/a 4 MB 25 W Q3 2013

Core i (4th gen)

Haswell-DT

Common features:

  • Socket: LGA 1150.
  • All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
    • All CPUs except for the i7-4770TE and embedded variants of desktop models support ECC memory.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 22 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4770TE 4 (8) 2.3 3.3 HD 4600 350–1000 8 MB 45 W June 2013
Core i5 4570TE 2 (4) 2.7 4 MB 35 W
Core i3 4340TE 2.6 N/a May 2014
4330TE 2.4 September 2013

The following models from the Haswell-DT desktop range are also available as embedded processors:

  • Core i7-4790S
  • Core i7-4770S
  • Core i5-4590S
  • Core i5-4590T
  • Core i5-4570S
  • Core i3-4360
  • Core i3-4350T
  • Core i3-4330

See section Desktop processors § Haswell-DT for full info.

Haswell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 5200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 22 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 4860EQ 4 (8) 1.8 3.2 Iris Pro 5200 750–1000 6 MB 47 W August 2013
4850EQ 1.6 3.2 650–1000
4701EQ 2.4 3.4 HD 4600 400–1000 Q3 2013
4700EQ June 2013
4700EC 2.7 N/a N/a 8 MB 43 W March 2014
4702EC 2.0 27 W
Core i5 4422E 2 (4) 1.8 2.9 HD 4600 400–900 3 MB 25 W April 2014
4410E 2.9 N/a 400–1000 37 W
4400E 2.7 3.3 400–1000 September 2013
4402E 1.6 2.7 400–900 25 W
4402EC 2.5 N/a N/a 4 MB 27 W March 2014
Core i3 4110E 2.6 HD 4600 400–900 3 MB 37 W April 2014
4112E 1.8 25 W
4100E 2.4 37 W September 2013
4102E 1.6 25 W

Core i (5th gen)

Broadwell-H

Common features:

  • Socket: BGA 1364.
  • All the CPUs support dual-channel DDR3L RAM, at up to 1600 MT/s speed.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 2.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 6200 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 5850EQ 4 (8) 2.7 3.4 Iris Pro 6200 300–1000 6 MB 47 W June 2015
5700EQ 2.6 HD 5600

Core i (6th gen)

Skylake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6700TE 4 (8) 2.4 3.4 HD 530 350–1000 8 MB 35 W September 2015
Core i5 6500TE 4 (4) 2.3 3.3 6 MB
Core i3 6100TE 2 (4) 2.7 N/a 4 MB Q4 2015

Skylake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2133, DDR3L-1600 or LPDDR3-1866 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Models with Iris Pro 580 iGPU also feature 128 MB of eDRAM, acting as L4 cache.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 6820EQ 4 (8) 2.8 3.5 HD 530 350–1000 8 MB 45 W October 2015
6822EQ 2.0 2.8 25 W
Core i5 6440EQ 4 (4) 2.7 3.4 6 MB 45 W
6442EQ 1.9 2.7 25 W
Core i3 6100E 2 (4) 2.7 N/a 350–950 3 MB 35 W
6102E 1.9 25 W

Core i (7th gen)

Kaby Lake-S

Common features:

  • Socket: LGA 1151.
  • All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i3 7101E 2 (4) 3.9 N/a HD 610 350–1100 3 MB 54 W January 2017
7101TE 3.4 35 W

Kaby Lake-H

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2400 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 7820EQ 4 (8) 3.0 3.7 HD 630 350–1000 8 MB 45 W January 2017
Core i5 7440EQ 4 (4) 2.9 3.6 6 MB
7442EQ 2.1 2.9 25 W
Core i3 7100E 2 (4) 2.9 N/a 350–950 3 MB 35 W
7102E 2.1 25 W

Core i (8th gen)

Whiskey Lake-U

Common features:

  • Socket: BGA 1528.
  • All the CPUs support dual-channel DDR4-2400 or LPDDR3-2133 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 8665UE 4 (8) 1.7 4.4 UHD 620 300–1150 8 MB 15 W April 2019
Core i5 8365UE 1.6 4.1 300–1050 6 MB June 2019
Core i3 8145UE 2 (4) 2.2 3.9 300–1000 4 MB

Core i (9th gen)

Coffee Lake-R

Common features:

  • Socket: LGA 1151-2.
  • All the CPUs support dual-channel DDR4-2400 RAM. i5 models and up support it at up to 2666 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 9700E 8 (8) 2.6 4.4 UHD 630 350–1150 12 MB 65 W June 2019
9700TE 1.8 3.8 35 W
Core i5 9500E 6 (6) 3.0 4.2 350–1100 9 MB 65 W
9500TE 2.2 3.6 35 W
Core i3 9100E 4 (4) 3.1 3.7 350–1050 6 MB 65 W
9100TE 2.2 3.2 35 W

Coffee Lake-H (refresh)

Common features:

  • Socket: BGA 1440.
  • All the CPUs support dual-channel DDR4-2666 RAM.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 9850HE 6 (12) 2.7 4.4 UHD 630 350–1150 9 MB 45 W June 2019
9850HL 1.9 4.1 25 W
Core i3 9100HL 4 (4) 1.6 2.9 350–1100 6 MB

Core i (10th gen)

Comet Lake-S

Common features:

  • Socket: LGA 1200.
  • All the CPUs support dual-channel DDR4-2666 RAM. i7 models and higher support it at up to 2933 MT/s speeds.
  • All CPU models provide 16 lanes of PCIe 3.0.
  • All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
  • L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
  • L2 cache: 256 KB per core.
  • Fabrication process: 14 nm.
  • i9-10900E features Thermal Velocity Boost.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i9 10900E 10 (20) 2.8 4.7 UHD 630 350–1200 20 MB 65 W April 2020
10900TE 1.8 4.5 35 W
Core i7 10700E 8 (16) 2.9 350–1150 16 MB 65 W May 2020
10700TE 2.0 4.4 35 W
Core i5 10500E 6 (12) 3.1 4.2 12 MB 65 W April 2020
10500TE 2.3 3.7 35 W
Core i3 10100E 4 (8) 3.2 3.8 350–1100 6 MB 65 W
10100TE 2.3 3.6 35 W

Core i (11th gen)

Tiger Lake-UP3

Common features:

  • Socket: BGA 1449.
  • All the CPUs support dual-channel DDR4-3200 or LPDDR4X-3733 RAM. i5 models and up support LPDDR4X at up to 4266 MT/s speed.
  • All CPU models provide 4 lanes of PCIe 4.0, in addition to PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • All models have configurable TDP (cTDP), which can be set from a minimum of 12 W to 28 W. Base clocks shown are at 15 W TDP; they will be different depending on the cTDP setting chosen.
  • -GRE suffix models have a minimum operating temperature of -40°C as opposed to 0°C for the normal models, and also feature "in-band ECC" for memory.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 1185GRE 4 (8) 1.8 4.4 Iris Xe
(96 EU)		 ?–1350 12 MB 15 W September 2020
1185G7E
Core i5 1145GRE 1.5 4.1 Iris Xe
(80 EU)		 ?–1300 8 MB
1145G7E
Core i3 1115GRE 2 (4) 2.2 3.9 UHD Graphics
(48 EU)		 ?–1250 6 MB
1115G4E

Tiger Lake-H

Common features:

  • Socket: BGA 1598.
  • All the CPUs support dual-channel DDR4-3200 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0, in addition to 24 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 3.0 bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 1.25 MB per core.
  • Fabrication process: 10 nm.
  • The base clock speed that the CPU runs at corresponds with the configurable TDP (cTDP) setting chosen.
  • Minimum operating temperature: 0°C.
Processor
branding		 Model Cores
(Threads)		 Clock rate (GHz) Integrated GPU Smart
Cache		 TDP Release
date
Base Turbo Model Clock (MHz)
Core i7 11850HE 8 (16) 2.1–2.6 4.7 UHD Graphics
(32 EU)		 350–1350 24 MB 35–45 W August 2021
Core i5 11500HE 6 (12) 4.5 12 MB
Core i3 11100HE 4 (8) 1.9–2.4 4.4 UHD Graphics
(16 EU)		 350–1250 8 MB

Core i (12th gen)

Alder Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz)
Base Turbo Base Turbo
Core i9 12900E 8 (16) 2.3 5.0 8 (8) 1.7 3.8 UHD 770 300–1550 30 MB 65 W January 2022
12900TE 1.1 4.8 1.0 3.6 35 W
Core i7 12700E 2.1 4 (4) 1.6 300–1500 25 MB 65 W
12700TE 1.4 4.6 1.0 3.4 35 W
Core i5 12500E 6 (12) 2.9 4.5 N/a 300–1450 18 MB 65 W
12500TE 1.9 4.3 35 W
Core i3 12100E 4 (8) 3.2 4.2 UHD 730 300–1400 12 MB 60 W
12100TE 2.1 4.0 35 W

The following Alder Lake-S desktop CPUs are also available in embedded variants:

  • The i5-12500, i7-12700, and i9-12900 support ECC memory when paired with the W680E chipset.
    • i9-12900
    • i7-12700
    • i5-12500
    • i5-12400
    • i3-12100

Alder Lake-U

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1265UE 2 (4) ? 4.7 8 (8) ? 3.5 Iris Xe
(96 EU)		 ?–1250 12 MB 15 W 55 W February 2022
Core i5 1245UE ? 4.4 ? 3.3 Iris Xe
(80 EU)		 ?–1200
Core i3 1215UE ? 4 (4) ? UHD Graphics
(64 EU)		 ?–1100 10 MB

Alder Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1270PE 4 (8) ? 4.5 8 (8) ? 3.3 Iris Xe
(96 EU)		 ?–1350 18 MB 28 W 64 W February 2022
Core i5 1250PE ? 4.4 ? 3.2 Iris Xe
(80 EU)		 ?–1300 12 MB
Core i3 1220PE ? 4.2 4 (4) ? 3.1 UHD Graphics
(48 EU)		 ?–1250 Q1 2022

Alder Lake-PS

Common features:

  • Socket: LGA 1700. While sharing the same socket as Alder Lake-S and Raptor Lake-S, this revision of LGA 1700 is electrically incompatible with other 12th and 13th generation Intel Core desktop processors.
  • All the CPUs support dual-channel DDR5-4800 or DDR4-3200 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 12800HL 6 (12) 2.4 4.8 8 (8) 1.8 3.7 Iris Xe
(96 EU)		 ?–1400 24 MB 45 W 65 W Q3 2022
12700HL 2.3 4.7 1.7 3.5
1265UL 2 (4) 1.8 4.8 1.3 2.7 ?–1250 12 MB 15 W 28 W
1255UL 1.7 4.7 1.2 2.6
Core i5 12600HL 4 (8) 2.7 4.5 2.0 3.3 Iris Xe
(80 EU)		 ?–1400 18 MB 45 W 65 W
12500HL 2.5 1.8
1245UL 2 (4) 1.6 4.4 1.2 2.5 ?–1250 12 MB 15 W 28 W
1235UL 1.3 1.1 ?–1200
Core i3 12300HL 4 (8) 2.0 4 (4) 1.5 3.3 UHD Graphics
(48 EU)		 ?–1400 45 W 65 W
1215UL 2 (4) 1.2 0.9 2.5 UHD Graphics
(64 EU)		 ?–1100 10 MB 15 W 28 W

Alder Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-4800, DDR4-3200, LPDDR5-5200 or LPDDR4X-4266 RAM.
  • All CPU models provide 16 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 1.25 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 12800HE 6 (12) 2.4 4.6 8 (8) 1.8 3.5 Iris Xe
(96 EU)		 ?–1350 24 MB 45 W 115 W January 2022
Core i5 12600HE 4 (8) 2.5 4.5 3.3 Iris Xe
(80 EU)		 ?–1300 18 MB
Core i3 12300HE 1.9 4.3 4 (4) 1.5 UHD Graphics
(48 EU)		 ?–1150 12 MB

Core i (13th gen)

Raptor Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
  • All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core on i7 and above models, 1.25 MB per core on i5 and below models.
    • E-cores: 4 MB per E-core cluster on i7 and above models, 2 MB per cluster on i5 and below models (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz)
Base Turbo Base Turbo
Core i9 13900E 8 (16) 1.8 5.2 16 (16) 1.3 4.0 UHD 770 300–1650 36 MB 65 W January 2023
13900TE 1.0 5.0 0.8 3.9 35 W
Core i7 13700E 1.9 5.1 8 (8) 1.3 300–1600 30 MB 65 W
13700TE 1.1 4.8 0.8 3.6 35 W
Core i5 13500E 6 (12) 2.4 4.6 1.5 3.3 300–1550 24 MB 65 W
13500TE 1.3 4.5 1.1 3.1 35 W
13400E 2.4 4.6 4 (4) 1.5 3.3 20 MB 65 W
Core i3 13100E 4 (8) 3.3 4.4 N/a UHD 730 300–1500 12 MB 60 W
13100TE 2.4 4.1 35 W

The following Raptor Lake-S CPUs are also available in embedded variants:

  • All CPUs except the i5-13500, i5-13500T, i3-13100, and i3-13100T support ECC memory when paired with the W680 chipset.
    • i9-13900
    • i7-13700
    • i7-13700T
    • i5-13500
    • i5-13500T
    • i5-13400
    • i5-13400T
    • i3-13100
    • i3-13100T

Raptor Lake-U

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1366URE 2 (4) 1.7 4.9 8 (8) 1.3 3.7 Iris Xe
(96 EU)		 ?–1300 12 MB 15 W 55 W January 2023
1365UE
Core i5 1345UE 1.4 4.6 1.2 3.4 Iris Xe
(80 EU)		 ?–1250
1335UE 1.3 4.5 0.9 3.3
Core i3 1315UE 1.2 4 (4) UHD Graphics
(64 EU)		 ?–1200 10 MB

Raptor Lake-P

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 4.0 and 12 lanes of PCIe 3.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core i7 1375PRE 6 (12) 1.9 4.8 8 (8) 1.9 3.7 Iris Xe
(96 EU)		 ?–1400 24 MB 28 W 64 W January 2023
1370PRE
1370PE ?
Core i5 1350PRE 4 (8) 1.8 4.6 1.8 3.4 Iris Xe
(80 EU)		 12 MB
1350PE ?
1340PE 4.5 ? 3.3 ?–1350
Core i3 1320PRE 1.7 4 (4) 1.7 UHD Graphics
(48 EU)		 ?–1200
1320PE ?

Raptor Lake-H

Common features:

  • Socket: BGA 1744.
  • All the CPUs support dual-channel DDR5-5200, DDR4-3200, LPDDR5-6400 or LPDDR4X-4266 RAM.
  • All CPU models provide 8 lanes of PCIe 5.0 and 8 lanes of PCIe 4.0, in addition to 12 lanes of PCIe 3.0 provided by the on-package PCH.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 80 KB (48 KB data + 32 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor

branding

 Model P-core (performance) E-core (efficiency) Integrated GPU Smart

Cache

 TDP Release

date

Cores

(Threads)

 Clock rate (GHz) Cores

(Threads)

 Clock rate (GHz) Model Clock (MHz) Base Max.

Turbo

Base Turbo Base Turbo
Core i7 13800HRE 6 (12) 2.5 5.0 8 (8) 2.5 4.0 Iris Xe

(96 EU)

 ?–1400 24 MB 45 W 115 W January 2023
13800HE 1.8
Core i5 13600HRE 4 (8) 2.7 4.8 2.7 3.6 Iris Xe

(80 EU)

 18 MB
13600HE 2.1
Core i3 13300HRE 2.1 4.6 4 (4) 3.4 UHD Graphics

(48 EU)

 ?–1300 12 MB
13300HE 1.9 3.4

Core i (14th gen)

Raptor Lake-R

Common features:

  • All CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipset.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
  • L2 cache: 2 MB per core.
  • Fabrication process: Intel 7.
  • Turbo Boost version is 2.0.
Processor branding Model P-core (Performance) Integrated GPU Smart

Cache

 TDP Release date
Cores

(Threads)

 Clock rate (GHz) Model Clock (MHz)
Base Turbo
Core i9 14901E 8 (16) 2.8 5.6 UHD 770 300 - 1650 36 MB 65 W Q3 2024
14901TE 2.3 5.5 45 W
Core i7 14701E 2.6 5.4 33 MB 65 W
14701TE 2.1 5.2 45 W
Core i5 14501E 6 (12) 3.3 300 - 1550 24 MB 65 W
14501TE 2.2 5.1 45 W
14401E 2.5 4.7 UHD 730 65 W
14401TE 2.0 4.5 45 W

The following Raptor Lake-S Refresh CPUs are also available in embedded variants:

  • All CPUs except for the i5-14400, i5-14400T, i3-14100, and i3-14100T support ECC memory when paired with the W680 chipset.
    • Core i9-14900
    • Core i9-14900T
    • Core i7-14700
    • Core i7-14700T
    • Core i5-14500
    • Core i5-14500T
    • Core i5-14400
    • Core i5-14400T
    • Core i3-14100
    • Core i3-14100T

Core / Core Ultra 3/5/7/9 (Series 1)

Meteor Lake-PS

Common features:

  • Socket: LGA 1851 (electrically incompatible with the socket used by non-embedded processors such as Arrow Lake-S).
  • All the CPUs support dual-channel DDR5-5600 RAM.
  • All CPU models provide 20 lanes of PCIe 4.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • Includes integrated graphics based on Alchemist architecture.
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 2 MB per E-core cluster (each "cluster" contains four cores).
  • All processor models also feature 2× "LP E-Cores" which are clocked at 0.7 GHz base, 2.1 GHz boost (2.5 GHz on HL-suffix models) and have 2 MB of L2 cache.
  • Fabrication process: Intel 4 (compute tile).
  • Configurable TDP (cTDP) of 12–28 W is featured on UL-suffix models, and 20–65 W on HL-suffix models.
Processor
branding		 Model P-core (performance) E-core (efficiency) Integrated GPU Smart
Cache		 TDP Release
date
Cores
(Threads)		 Clock rate (GHz) Cores
(Threads)		 Clock rate (GHz) Model Clock (MHz) Base Max.
Turbo
Base Turbo Base Turbo
Core Ultra 7 165HL 6 (12) 1.4 5.0 8 (8) 0.9 3.8 Intel Arc
(8 Xe-cores)		 ?–2300 24 MB 45 W 115 W April 2024
155HL 4.8 ?–2250
165UL 2 (4) 1.7 4.9 1.2 Intel Graphics
(4 Xe-cores)		 ?–2000 12 MB 15 W 57 W
155UL 4.8 ?–1950
Core Ultra 5 135HL 4 (8) 4.6 1.2 3.6 Intel Arc
(8 Xe-cores)		 ?–2200 18 MB 45 W 115 W
125HL 1.2 4.5 0.7 Intel Arc
(7 Xe-cores)
135UL 2 (4) 1.6 4.4 1.1 Intel Graphics
(4 Xe-cores)		 ?–1900 12 MB 15 W 57 W
125UL 1.3 4.3 0.8 ?–1850
Core Ultra 3 105UL 1.5 4.2 4 (4) 1.0 3.5 Intel Graphics
(3 Xe-cores)		 ?–1800 10 MB

Core / Core Ultra (Series 2)

Bartlett Lake-S

Common features:

  • Socket: LGA 1700.
  • All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM. The Core 5 221E and higher models support DDR5-5600.
  • All CPU models provide 20 lanes of PCIe 4.0 or PCIe 5.0.
  • All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
  • L1 cache:
    • P-cores: 112 KB (48 KB data + 64 KB instructions) per core.
    • E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
  • L2 cache:
    • P-cores: 2 MB per core.
    • E-cores: 4 MB per E-core cluster (each "cluster" contains four cores).
  • Fabrication process: Intel 7.
Processor

branding

 Model P-core (performance) E-core (efficiency) Integrated GPU Smart

Cache

 TDP Release

date

Cores

(Threads)

 Clock rate (GHz) Cores

(Threads)

 Clock rate (GHz) Model Clock (MHz)
Base Turbo Base Turbo
Core 7 251E 8 (16) 2.1 5.6 8 (8) 1.6 4.4 UHD 730 300 - 1660 36 MB 65 W Q1 2025
251TE 1.4 5.4 1.0 3.9 45 W
Core 5 221E 6 (12) 2.7 5.2 8 (8) 2.1 3.9 300 - 1550 24 MB 65 W
221TE 1.8 5.0 1.3 3.6 45 W
211E 2.7 4.9 4 (4) 2.0 3.7 20 MB 65 W
211TE 1.7 4.8 1.3 3.4 45 W
Core 3 201E 4 (8) 3.6 4.8 -- 12 MB 60 W
201TE 2.9 4.6 45 W

See also

References

  1. ↑ "Intel product specifications". www.intel.com. Retrieved March 4, 2026.{{cite web}}: CS1 maint: url-status (link)
  2. ↑ "Products formerly Raptor Lake". www.intel.com. Retrieved February 28, 2026.{{cite web}}: CS1 maint: url-status (link)