| General information | |
|---|---|
| Launching | Datacenter Q4 2026 Desktop H1 2027 (expected) |
| Designed by | AMD |
| Common manufacturer | |
| CPUID code | Family 1Ah |
| Physical specifications | |
| Cores |
|
| Memory (RAM) | |
| Sockets |
|
| Cache | |
| L1 cache | 80 KB (per core):
|
| L2 cache | 1 MB (per core) |
| L3 cache | 48 MB (per CCD) 128 MB (per CCD on Venice-X) |
| Architecture and classification | |
| Technology node | TSMC N2P (CCD) to TSMC N6 (IOD) |
| Microarchitecture | Zen |
| Instruction set | AMD64 (x86-64) |
| Extensions | |
| Products, models, variants | |
| Core names |
|
| Product code names |
|
| Brand names | |
| History | |
| Predecessor | Zen 5 |
| Successor | Zen 7 |
| Support status | |
| Unreleased | |
Zen 6 ("Morpheus") is the name for an upcoming CPU microarchitecture from AMD, shown on their roadmap in July 2024. It is the successor to Zen 5 and is believed to use TSMC's 6 nm and 2 nm processes. Desktop processors will be codenamed "Olympic Ridge", expected to be released under the Ryzen 10000 name, the Ryzen Threadripper (HEDT or Workstation) processors are codenamed "Mustang Peak", while Epyc server processors will be codenamed "Venice", "Venice-X", "Venice LP" & "Verano". The mobile processors include several lineup codenames: "Bumblebee" at the low-end, "Medusa Point" for the mainstream lineup, "Medusa Halo" represents a high-end APU with a large iGPU, and "Gator Range" providing the highest mobile performance.[citation needed]
Zen 6 is expected to release in late 2026 to early 2027. It is expected that each Core Complex Die (CCD) will contain up to 12 cores each, enabling a maximum of 24 cores (48 threads) for consumer platform chips and 256 cores (512 threads) on server platform chips.
The architecture is confirmed to introduce new instruction extensions, including AVX512_BMM, AVX_NE_CONVERT, AVX_IFMA, AVX_VNNI_INT8, and AVX512_FP16. It is also expected that Zen 6 will be the first platform supporting Flexible Return and Event Delivery (FRED).
Like with the previous two Zen generations, Zen 6 will come in a standard variant, as well as a high-core-density variant named Zen 6c ("Monarch"). Each CCD will hold up to 32 cores. This will be used for server chips, and is speculated to also be for mobile platforms.
A new variant is set to debut, named Zen 6 LP. This variant is similar in function to Intel's LP-E cores in processors such as Meteor Lake and Panther Lake, handling background tasks along with maintaining hybrid sleep. However, unlike Intel's Darkmont, Zen 6 LP will be a more condensed and underclocked form of Zen 6c, and as such will retain the same IPC, instruction sets, and extensions as Zen 6 and Zen 6c.[citation needed] The Zen 6 LP variant will be present in mobile chips and system on a chip (SoCs), handheld Accelerated Processing Units (APUs), the upcoming PlayStation 6 console's SoC, upcoming PlayStation 6 handheld's SoC and upcoming Xbox console's SoC.[failed verification]
The Epyc 9006 series of high-performance server processors using Zen 6, codenamed Venice, were also announced at AMD Accelerating AI event on July 23, 2026. Venice and Venice X both use SP7 or SP8 sockets depending on the model of processor, and packs up to 96 cores and 192 threads on the top-end model. Venice is built on a TSMC 3 nm process[citation needed].
Common features of EPYC 9006 server processers:
| Branding and Model | Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
TDP | Chiplets | Core config |
Socket | Release date |
Launch price | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Base | Boost | ||||||||||
| Epyc | 9G76 | 96 (192) | 3.4 | 4.8 | 384 MB | 500 W | 8 × CCD 2 × I/OD |
8 × 12 | SP7 | TBA | TBA |
| 9686F | 5.0 | ||||||||||
| 9556 | 64 (128) | 2.75 | 4.3 | 300 W | 8 × 8 | ||||||
| 9586F | 3.75 | 5.0 | 500 W | ||||||||
| 9576F | 3.55 | 400 W | SP8 | ||||||||
| 9476F | 48 (96) | 3.65 | 5.0 | 192 MB | 330 W | 4 × CCD 2 × I/OD |
4 × 12 | ||||
| 9016 | 8 (16) | 3.05 | 4.8 | 48 MB | 130 W | 1 × CCD 1 × I/OD |
1 × 8 | ||||
A variant of Epyc 9006 using Zen 6c was also announced at AMD Accelerating AI event, codenamed Venice-X. It features a maximum of 256 cores and 512 threads, 128 MB of L3 cache, and is manufactured on a 2 nm process.
Common features of EPYC Dense 9006 server processers:
| Branding and Model | Cores (threads) |
Clock rate (GHz) | L3 cache (total) |
TDP | Chiplets | Core config |
Socket | Release date |
Launch price | ||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Base | Boost | ||||||||||
| Epyc | 9996 | 256 (512) | 2.55 | 4.1 | 1024 MB | 600 W | 8 × CCD 2 × I/OD |
8 × 32 | SP7 | TBA | TBA |
| 9966 | 192 (384) | 2.9 | 4.0 | 768 MB | 6 × CCD 2 × I/OD |
6 × 32 | |||||
| 9846 | 168 (336) | 2.85 | 3.7 | 500 W | 6 × 28 | ||||||
| 9756 | 128 (256) | 3.15 | 4.0 | 512 MB | 4 × CCD 2 × I/OD |
4 × 32 | |||||
| 9746 | 2.9 | 400 W | SP8 | ||||||||
| 9656 | 96 (192) | 3.05 | 3.7 | 4 × 24 | SP7 | ||||||